| 摘要 |
PROBLEM TO BE SOLVED: To provide packing structure which improves its water proofing performance by easing and absorbing the dimensional changes in a packing section, which is caused by the difference in the thermal expansion coefficients of materials used for cases, lids, etc., which are components of packing structure, which are caused by the changes in the temperature of electronic equipment. SOLUTION: The coefficients of thermal expansion of packings 13 and 14 are different from each other, and the coefficients of thermal expansion of one of the two packings accords with that of the lid 12, and the coefficients of thermal expansion of the other one accords with that of the case 11. One packing is placed on the other packing with their side face directions become perpendicular to each other.
|
