| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of an end face type thermal head having heating resistors arranged on the end face that the yield does not increase in proportion to the area of a substrate even if a high yield ceramic substrate for ordinary non-end face type thermal head is employed because the heating resistors are formed at the end of the ceramic substrate and the product can be formed only in the vicinity of the end face, and the problem that the labor for filming and photolithography is increased because the heating resistors are arranged on the end face and the patterning area is increased and thereby it is difficult technically to keep continuity of electrode between the planar part and the end face and mass productivity is low. SOLUTION: Using a highly flexible basic material, e.g. a polyimide resin sheet, heating resistors, discrete electrodes, signal input electrodes and a protective film are formed on one plane of the basic material using sputtering and a photolithographic process and then it is patterned. Heater drive elements are mounted on the same plane, the discrete electrodes and the signal input electrodes are bonded electrically, the drive elements and the electrical bonding part are protected with resin adhesive and then it is stuck to a rigid body of resin and metal, e.g. a beveled flat plate, thus constituting a thermal head.
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