| 摘要 |
A dual-chip packaging structure comprises a die pad with a chip attached to each of its two surfaces. Outside and around the die pad is a plurality of first metal studs. A plurality of second metal studs is arranged outside and around the first metal studs. Connections between the first metal studs and the second metal studs are made by means of a plurality of conductive traces. The two chips on the respective surfaces of the die pad are connected to corresponding ends of the first metal studs through bonding wires. An insulating material is employed to enclose the two chips, the die pad, the first metal studs, the conductive traces, and ends of the second metal studs, with other ends of the second metal studs exposed. A plurality of solder balls is attached to the respective exposed ends of the second metal studs.
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