| 摘要 |
PROBLEM TO BE SOLVED: To shorten the time for developing a wiring pattern. SOLUTION: A semiconductor device 10 includes a substrate 12, and a wiring pattern is formed on the surface of the substrate 12. The wiring pattern includes electrodes 18a, WB pads 18b, and connecting parts 18c. The WB pad 18b is formed, such that a longitudinal direction Q is substantially in parallel with a line P, which extends radially from a center X of a DB region 28. Therefore, when a chip 16 of a first size is bonded in the DB region, bonding wires 24 are substantially in parallel with the longitudinal direction Q. Furthermore, even when a chip 16 which is smaller than the first-size chip 16 in the same shape is bonded, the bonding wires 24 are substantially in parallel with the longitudinal direction Q. Since, in this way, the same substrate 12 can be used regardless of the chip size, it is not necessary to prepare a plurality of wiring patterns according to chip sizes. |
