发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability and low thermal resistance. SOLUTION: A part of a lead frame is bent vertically and led outside to constitute a terminal electrode. A main circuit is bonded to a base plate through a resin layer, and the terminal electrode of the lead frame is raised after element formation. |
申请公布号 |
JP2002033433(A) |
申请公布日期 |
2002.01.31 |
申请号 |
JP20000217240 |
申请日期 |
2000.07.13 |
申请人 |
HITACHI LTD |
发明人 |
OGAWA TOSHIO;TAKAHASHI MASAAKI;KOBAYASHI TOSHIYUKI;KAMIMURA NORITAKA;YAMADA KAZUJI;TANI SHOGO;SASAKI YASUSHI;NAKATSU KINYA;UENO TAKUMI |
分类号 |
H01L25/07;H01L23/50;H01L25/18;(IPC1-7):H01L23/50 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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