| 摘要 |
PROBLEM TO BE SOLVED: To make a printed wiring board small by joining a chip component between a semiconductor device and the printed wiring board. SOLUTION: The semiconductor device is composed of a conductor ball 1, wring conductors 2 and 3, an insulator poser 3, a semiconductor element 4a, a semiconductor element circuit 4b, a semiconductor element electrode pad 4c, a guard ring 5 made of a conductor, a printed wiring board 6, a printed wiring board electrode 7, the chip component 8, and an electric conductor 9. Part or the whole of the small-sized chip component 8 of the semiconductor device between the wiring conductor 2 and printed wiring board electrode 7 is bonded with the electric conductor 9. Thus, the chip component 8 is bonded between the wiring conductor 2 and the printed wiring board electrode 7, so the occupation area of the chip component 8 on the printed wiring board 6 is reduced, and an electronic computer, a portable information terminal, etc., can be made small-sized.
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