CUTTING INSTRUMENT HAVING INTEGRATED SENSORS

摘要

A cutting instrument including a metal blade (10) has a recess (20) formed therein. A semiconductor substrate (35) having at least one sensor (30) is affixed to the blade (10) in the recess (20). The blade (10) may be affixed to handle, with the semiconductor substrate (35) being electrically coupled to the handle. The handle may be coupled to a computer adapted to store and/or display information based on signals generated by one or more of the sensors. A method of making a cutting instrument includes forming at least one sensor (30) on a semiconductor wafer according to a pattern that matches the defined shpe of the semiconductor substrate. The portion of the semiconductor wafer not covered by the photresist is removed and thereafter the photoresist is removed. The semiconductor substrate is affixed to a metal blade in a recess formed in the blade.