发明名称 |
METHOD FOR FORMING INTER-WIRING CONNECTION HOLE |
摘要 |
PROBLEM TO BE SOLVED: To easily form an inter-wiring hole in the part of the terminal of a special structure. SOLUTION: The structure K is formed by arranging unit blocks 39 in the recesse of a glass substrate 52. The terminals 39A and 39B of the unit blocks 39 and terminals 52A and 52B which are directly formed in the glass substrate 52 are exposed onto the surface of the structure K. A film 1 constituted of the polyvinyl pyrrolidone is formed on the whole surface (face where the respective terminals are exposed) of the structure K. Methanol 3 is discharged to the parts of the terminals 39A and 52A of the film 1 from the head 2 of an ink jet device. Since polyvinyl pynolidone is dissolved into methanol, the parts of the terminals 39A of the coat 1 are destroyed by methanol. Consequently, through holes 10 are formed in the film 1 and the terminals 39A are exposed.
|
申请公布号 |
JP2002026229(A) |
申请公布日期 |
2002.01.25 |
申请号 |
JP20000207387 |
申请日期 |
2000.07.07 |
申请人 |
SEIKO EPSON CORP |
发明人 |
SHIMODA TATSUYA;MIYASHITA SATORU;INOUE SATOSHI;ISHIDA MASAYA |
分类号 |
H01L21/306;H01L21/312;H01L23/52;(IPC1-7):H01L23/52 |
主分类号 |
H01L21/306 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|