| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method of manufacturing printed wiring board by which a wiring layer can be formed reasonably as thin as possible. SOLUTION: Through an insulating layer 5 on both surfaces 2a and 2b of which wiring layers 3 and 4 are respectively formed, a via hole 7 is formed in such a way that the hole 7 is opened on one surface 2a and closed by the insulating layer 4 on the other surface 2b. After the surface 2b of the layer 5 is coated with a first resist 15, first plating is performed to continuously cover the internal surface of the via hole 7, the wiring layer 4 exposed in the via hole 7 and formed on the surface 2b, and the wiring layer 3 formed on the surface of the layer 5 with a first plated layer 8. Then, after the surroundings of the opening 7a of the via hole 7 on the surface 2a of the layer 5 are coated with a second resist 16, a second plated layer 10 is laminated upon the first plated layer 8 by performing second plating so as to electrically connect the wiring layers 3 and 4 formed on both surfaces of the layer 5 to each other through the plated layers 8 and 10. Finally, the first and second resists 15 and 16 are removed. |
