SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide mounting technology which is suitable to a chip which has many terminals as to a semiconductor device which has a chip mounted on a wiring board in the flip-chip way across bump electrodes. SOLUTION: On the main surface of a silicon chip 6A, solder bumps 8 are arranged in matrix. The gap between the silicon chip 6A and a module substrate 2 is filled with anisotropic conductive resin 10 and the solder bumps 8 and electrode pads 4 of the module substrate 2 are electrically connected through metal particles in the anisotropic conductive resin 10.