Metal barrier for copper interconnects that incorporates silicon in the metal barrier or at the copper/metal barrier interface

摘要

A copper interconnect having a barrier layer (106, 206). A metal barrier layer may be co-deposited with Si to form barrier (106) or a metal barrier layer may be deposited followed by surface treatment with a Si-containing ambient to form barrier (206). The copper (110) is then deposited over the said barrier layer (106,206) with good adhesion.