发明名称 |
METHOD FOR PRODUCING FINE SILICA POWDER |
摘要 |
PROBLEM TO BE SOLVED: To easily produce fine silica powder suitable for use as a filler for a semiconductor sealant and having a sharp particle size distribution which is mainly in a submicron range. SOLUTION: In the method for producing the fine silica powder, an aqueous slurry containing metallic silicon powder is sprayed in a hot field at >=10 m/see jetting rate and the resulting silica powder is collected. Preferably the slurry is prepared using a medium agitation type wet grinder, the hot field is a chemical flame and the slurry is an aqueous slurry having 20-70% concentration of metallic silicon powder.
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申请公布号 |
JP2002020113(A) |
申请公布日期 |
2002.01.23 |
申请号 |
JP20000352328 |
申请日期 |
2000.11.20 |
申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
YOSHIDA AKIO;ICHIKAWA KOKI;NAGASAKA HIDEAKI;WATANABE SHOJIRO |
分类号 |
C01B33/18;C08K3/36;(IPC1-7):C01B33/18 |
主分类号 |
C01B33/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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