发明名称 PACKAGING MATERIAL FOR SOYBEAN PASTE AND SOYBEAN PASTE PACKAGE USING IT
摘要 PROBLEM TO BE SOLVED: To provide a packaging material for soybean paste which has strength, etc., is excellent in heat resistance, moisture-proofing properties, heat-sealing properties, pinhole resistance, stab resistance, transparency, etc., excellent in gas-barrier properties for preventing the permeation of oxygen gas, water vapor, etc., has an aptitude for packing/packaging/preserving contents, does not generate harmful substances, etc., when subjected to incineration disposal treatment after being used, and is excellent in disposal treatment aptitude, environmental aptitude, etc., and a soybean paste package with the use of it. SOLUTION: The packaging material for soybean paste in which a vapor- deposition film of an inorganic oxide is formed on one side of a base material film, a primer layer, a printed pattern layer, and an adhesive layer for lamination are formed in turn on the vapor-deposition film, and a heat-sealing resin layer is formed on the adhesive layer and the soybean paste package with the use of it are concerned.
申请公布号 JP2002019004(A) 申请公布日期 2002.01.22
申请号 JP20000209373 申请日期 2000.07.11
申请人 DAINIPPON PRINTING CO LTD 发明人 FUJII HITOSHI
分类号 B65D85/72;B29C55/12;B32B9/00;B32B33/00;B65D65/40;B65D81/24;C23C14/08;C23C16/40;(IPC1-7):B32B9/00 主分类号 B65D85/72
代理机构 代理人
主权项
地址