| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polisher capable of uniformly polishing the whole surface of a wafer by preventing excessive polishing for the outer peripheral edge of the wafer. SOLUTION: In this wafer polisher 10, a pressing member 16 pressed to a polishing pad 20 is disposed on a holding head 14 close to the polishing pad 20 on the upstream side in the rotating direction of the polishing pad 20. The pressing member 16 is formed substantially like a semi-circular arc along the outer periphery of the holding head 14 to cover the upstream side whole peripheral edge part of the holding head 14. As a raised part of the polishing pad 20 caused by the pressing member 15, only a raised part 20A corresponding to the outer peripheral edge 16A of the pressing member 16 and a raised part 20B corresponding to the inner peripheral edge 16B of the pressing member 16 are caused apart from the outer peripheral edge 30A of the wafer 30, to prevent excessive polishing for the wafer outer peripheral edge 30A by raised parts 20A, 20B. |
