WIRING CIRCUIT BOARD HAVING BUMP AND ITS MANUFACTURING METHOD

摘要

PURPOSE: To manufacture a wiring circuit board having bumps for enabling stable bump connection and eliminating the need for a complex operation such as the pretreatment of plating. CONSTITUTION: An etching mask 7 for forming bumps is formed on a bump formation surface 3a of metal foil 3 having a thickness (t1+t2) obtained by adding thickness t1 of a wiring circuit 1 and height t2 of a bump 2 to be formed, the bump 2 is formed by half-etching to depth equivalent to the anticipated bump height t2 from the side of the etching mask 7 for forming bumps, and a metal thin-film layer 10 made of metal that differs from the metal foil 3 is formed on the bump formation surface of the metal foil 3, thus providing the wiring circuit board having bumps for enabling stable bump connection and eliminating the need for a complex operation such as the pretreatment of plating.