| 摘要 |
The housing (10) includes a chip (11) which is protected by a cover (12) and a counter cover. Conductive tracks (15,16) are on the underside of the covers transparent plastic, e.g. polyimide, flexible substrate (14) and they are connected to the chip contact surface areas (21,22). The base of the package has a similar substrate (23) with conductive tracks (24,25) on top which connect to the chip connected conductive tracks. The contact surface areas on the chip are connected by contact metallisations (19,20) to the inner ends (17,18) of the tracks on the cover. The outer ends (30,31) of the tracks on the base are freely accessible and lead to external terminals (32,33) of the package. The chip can be connected to other chips via surrounding cover connection regions of the flexible substrate. |
