PRINTED CIRCUIT BOARD FOR EXHAUSTING VAPOR AND BALL GRID ARRAY PACKAGE USING THE SAME

摘要

PURPOSE: A printed circuit board for exhausting vapor and a ball grid array package using the same are provided to exhaust vapor generated from an adhesion area between a semiconductor chip and a substrate. CONSTITUTION: A semiconductor chip(110) is adhered on an upper face of a printed circuit board(120) by a conductive adhesive(130). The semiconductor chip(110) is connected electrically with the printed circuit board(100) by using a bonding wire(140). A resin sealing portion(150) is formed by sealing the semiconductor chip(110) formed on the printed circuit board(120) and the bonding wire(140). A solder ball is located on a lower face of the printed circuit board(120). A circuit line pattern(126) is formed on both sides of a substrate body(121) of the printed circuit board(120). The circuit line pattern(126) is formed with an upper line pattern and a lower line pattern including a solder ball pad(127). A solder resist layer(129) is formed on an upper face of a lower face of the substrate body(121).