发明名称 MOLD CLAMPING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mold clamping device, stoppers and a movable platen of which do not break even through the repeated use of the device wherein the impact for abutting the movable platen against the tip of the stopper is made smaller than ever. SOLUTION: This mold clamping device has a mold opening amount detecting sensor 21 for detecting the mold opening amount of a movable mold 52 and a mold opening controlling circuit 30, which controls the abutting speed of the movable mold 52 against the stoppers 17 based on the detection result of the mold opening amount detecting sensor 21 by operating a driving source 16.
申请公布号 JP2002011770(A) 申请公布日期 2002.01.15
申请号 JP20000194051 申请日期 2000.06.28
申请人 SUMITOMO HEAVY IND LTD 发明人 ISHII SHIGEO
分类号 B29C45/67;B29C45/76;(IPC1-7):B29C45/67 主分类号 B29C45/67
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