| 发明名称 |
Buffer solutions for suspensions used in chemical-mechanical polishing |
| 摘要 |
The present invention relates to buffer systems in the form of solutions or salts for preparing suspensions which can be used for chemomechanical polishing. In particular, these buffer systems can be used for preparing suspensions having a high pH of 9.5-13 which are used for the chemomechanical polishing of Si and metal surfaces of semiconductors, known as wafers.
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| 申请公布号 |
US6338743(B1) |
申请公布日期 |
2002.01.15 |
| 申请号 |
US20000403098 |
申请日期 |
2000.04.03 |
| 申请人 |
MERCK PATENT GESELLSCHAFT MIT BESCHRANKTER HAFTUNG |
发明人 |
DUSEMUND CLAUS;RHEIN RUDOLF;SCHWEIKERT MANUELA;HOSTALEK MARTIN |
| 分类号 |
C09G1/02;C09K3/14;C23F3/00;H01L21/304;H01L21/306;(IPC1-7):C09G1/00;C09G1/04 |
主分类号 |
C09G1/02 |
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