| 摘要 |
PURPOSE: Provided is a method and a device with which flexible substrates can be equipped with semiconductor chips in reliable and high quality. CONSTITUTION: The mounting of semiconductor chips(1) onto a flexible substrate(2) takes place in three steps. Firstly, at a dispensing station(3), an adhesive agent(4) is applied to a predetermined substrate sites on the substrate(2). Then, at a bonding station(6), semiconductor chips(1) are placed onto the substrate sites. Finally, curing of the adhesive agent(4) takes place. At this time, the substrate(2) is fixed onto a level support surface(10) by means of vacuum during the hardening of the adhesive agent(4).
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