| 摘要 |
PURPOSE: Provided are adhesive compositions containing a base resin and an epoxy resin with allyl or vinyl functionality which show enhanced adhesive strength and can be used in microelectronic applications. CONSTITUTION: The die attach adhesive composition comprises: (a) a resin capable of curing by free-radical polymerization or by hydrosilation, present in an amount of 10% to 80% by weight, (b) an epoxy compound having vinyl or allyl functionality, present in an amount of 0.1% to 30% by weight, (c) a curing agent for the epoxy compound, present in an amount of 0.1% to 3% by weight, (d) a curing agent for the resin, present in an amount of 0.1% to 10% by weight, and (e) optionally, a filler, present in an amount of 20% to 90% by weight. |
