GROUND SUBSTRATE, SUBSTRATE GRINDING DEVICE AND GRINDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a ground substrate which has a bank 1-3μm high along its periphery. SOLUTION: A grindstone 5 in disc form whose center is fixed on an axis 6 of rotation placed above a chuck 2 in parallel with its surface is lowered toward the surface of a substrate (w) in nearly disc shape which is placed on the horizontally rotatable chuck 2 until the peripheral wall of the grindstone 5 in disc form comes into contact with the substrate surface and the substrate surface is ground by pressing the turning grindstone 5 in disc form against the substrate (w) which is horizontally rotated by the rotation of the chuck 2, while a grind lubricant is supplied to the substrate surface and one of the chuck 2 and the grindstone 5 in disc form is shifted from side to side. In the final process of grinding, the turning grindstone 5 in disc form is vertically raised step by step when the relative position of grindstone 5 to the substrate w has reached from the center of the substrate w up to near its circumference. In this way, substrate w each provided with a rounded bank along its periphery are manufactured.