| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical wiring module and the manufacturing method capable of facilitating positioning between an optical element and an optical waveguide, reducing a manufacture cost, enabling the high-speed transmission of optical signals between semiconductor chips, and obtaining sufficient reliability with stable operations. SOLUTION: This optical wiring module 1 is provided with the semiconductor chips 11 and 12, a first insulation layer 14 for covering the semiconductor chips 11 and 12, a light emitting element 15 and a light receiving element 16 arranged on the first insulation layer 14, a second insulation layer 17 for covering the light emitting element 15 and the light receiving element 16, and the optical waveguide 18 transferred on the second insulation layer 17. The light emitting element 15 converts electric signals from the semiconductor chip 11 to the optical signals and emits them. The optical signals are propagated through the optical waveguide 18 and then made incident on the light receiving element 16. The light receiving element 16 converts the incident optical signals to the electric signals and then outputs them to the semiconductor chip 12. |
