发明名称 METHOD AND APPARATUS FOR BARREL PLATING
摘要 PROBLEM TO BE SOLVED: To reduce the variance of the plating deposition, and to reduce the number of workers and the installation area of a barrel plating apparatus by intermittently moving barrel units successively from an end in a plating tank, and implementing the plating while the barrel units are stopped. SOLUTION: The barrel units 8 are intermittently moved and carried in the transverse direction in the plating tank 2 by using the barrel units 8 with electronic components stored in a barrel and an electrode brought into electric contact with a medium led to a current collector 9 outside the barrel, a power supplier 7 with the current collector 9 brought into contact therewith at the stop position of the intermittently carried barrel units 8, and a power supplying means to conduct the current arbitrarily set for each electric supplier to the current collector, and the predetermined current is conducted to the electrode of the stopped barrel units 8 at the stopped position via the power supplier 7 and the current collector 9.
申请公布号 JP2002004096(A) 申请公布日期 2002.01.09
申请号 JP20000180995 申请日期 2000.06.16
申请人 TDK CORP 发明人 MORI KANEO;ONODERA AKIRA;KONNO TADAYOSHI;KUME HISASHI;SAKURAI TAKASHI
分类号 C25D17/16;(IPC1-7):C25D17/16 主分类号 C25D17/16
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