APPARATUS FOR MOLDING SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: An apparatus for molding a semiconductor chip package is provided to eliminate the problem of insufficient tons of a press in a die of the semiconductor chip package, by using a cavity block having a concave part on its lower surface so that a pressure clamping a dam bar surface of a leadframe is compensated. CONSTITUTION: Upper/lower cavity blocks have a plurality of cavities which have the same shape as the outer shape of the semiconductor chip package to mold. Upper/lower dies(10,20) include the upper/lower cavity blocks. The press presses the upper/lower dies. The concave part is formed on the lower surface of the lower cavity block(25) of the upper/lower cavity blocks.