发明名称 COVER TAPE FOR FEEDING ELECTRONIC PART AND ELECTRONIC PART FEED BODY
摘要 <p>PURPOSE: To obtain a cover tape for feeding an electronic part having both of good conductivity and proper adhesiveness and capable of reducing the irregularity of peel strength at the time of peeling. CONSTITUTION: The cover tape for feeing the electronic part comprises a laminate of four or more layers formed by successively laminating at least one layer selected from an undercoating layer and an intermediate layer and an adhesive layer on a support, and by providing a conductive layer formed on at least the back surface of the support and the surface of the adhesive layer by vapor deposition. The conductive layer can be constituted of, for example, Al, Cu, Ag, Ni, Ti, Fe, Cr, Zr, Ta, Zn or an alloy containing these metals and has a thickness of about 1-200Å. The undercoating layer can be constituted of, for example, a urethane adhesive or an electrostatic induction preventing adhesive and the intermediate layer can be constituted of, for example, a polyolefinic resin.</p>
申请公布号 KR20020001654(A) 申请公布日期 2002.01.09
申请号 KR20010037590 申请日期 2001.06.28
申请人 NITTO DENKO CORPORATION 发明人 ICHIKAWA HIROKI;IZUTANI SEIJI;NAKANO ICHIRO
分类号 B65D73/02;B65D65/40;B65D73/00;B65D85/86;(IPC1-7):B65D73/00 主分类号 B65D73/02
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