发明名称 MOLD RELEASE FILM
摘要 PROBLEM TO BE SOLVED: To provide a mold release film having good resin retentivity in the case of laminating a plurality of layers of laminates having via holes through a prepreg and good heat resistance at a low cost. SOLUTION: The mold release film is used in a step of pressing the prepreg at a copper-clad laminate manufacturing time. The mold release film comprises a mold release layer provided on one side surface or both side surfaces of a polyester foamed film. The release layer is preferred to be formed by treating the layer with a silicone mold release agent.
申请公布号 JP2002001726(A) 申请公布日期 2002.01.08
申请号 JP20000190468 申请日期 2000.06.26
申请人 FUJIMORI KOGYO CO LTD 发明人 HAYASHI MASUFUMI;TAIMA KAZUO
分类号 B29B11/16;B29C70/06;B32B5/18;B32B27/00;B32B27/36;H05K1/03;(IPC1-7):B29B11/16 主分类号 B29B11/16
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