发明名称 |
MOLD RELEASE FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a mold release film having good resin retentivity in the case of laminating a plurality of layers of laminates having via holes through a prepreg and good heat resistance at a low cost. SOLUTION: The mold release film is used in a step of pressing the prepreg at a copper-clad laminate manufacturing time. The mold release film comprises a mold release layer provided on one side surface or both side surfaces of a polyester foamed film. The release layer is preferred to be formed by treating the layer with a silicone mold release agent.
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申请公布号 |
JP2002001726(A) |
申请公布日期 |
2002.01.08 |
申请号 |
JP20000190468 |
申请日期 |
2000.06.26 |
申请人 |
FUJIMORI KOGYO CO LTD |
发明人 |
HAYASHI MASUFUMI;TAIMA KAZUO |
分类号 |
B29B11/16;B29C70/06;B32B5/18;B32B27/00;B32B27/36;H05K1/03;(IPC1-7):B29B11/16 |
主分类号 |
B29B11/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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