METHOD AND APPARATUS FOR PLASMA TREATMENT

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for plasma treatment adapted so as to prevent thermal damage to a substrate during consecutive plasma treatments to prevent it from being deformed or from being adversely affected in its properties. SOLUTION: A rise in the temperature of the surface of a substrate 5 can be prevented by indirectly cooling the surface of the substrate 5 by providing a cooling holder 11 in the position opposite to the substrate 5 during consecutive plasma treatments and sealing a gas having a high heat conductivity in the space between the substrate 5 and the holder 11 spaced therefrom.