发明名称 INTEGRATED MICROCONTACT PIN AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To perform a high-speed signal test to a high density LSI with an electrode interval, for example, of about 150μm prior to packaging. SOLUTION: Terminal coaxial lines 13 formed through a terminal support 11 are two-dimensionally aligned, and one end of a contact 18 as conductive whisker is mounted on each end of the lines 13. A transmission line block 61 three-dimensionally extended upward is mounted on the other end through a connecting plate 72 having the same structure as the terminal support 11. One end of the block 61 is connected to the other end of the coaxial line 13, and relay high frequency transmission lines 62 for passing a direct current which are adjacently arranged at extended intervals is retained on the upper end. The extended transmission lines 62 are connected to a performance board (not shown). The length of the contact 18 is set to about 0.3-0.5 mm, and the characteristic impedance is retained to this position. The terminal support 11 is replaceable.
申请公布号 JP2001356136(A) 申请公布日期 2001.12.26
申请号 JP20000179423 申请日期 2000.06.15
申请人 ADVANTEST CORP 发明人 YOSHIDA HARUO;MAEDA YASUHIRO;MIYAGAWA YOSHIHIDE
分类号 G01R31/26;G01R1/04;G01R1/067;G01R1/073;G01R31/28;H01L21/66;(IPC1-7):G01R1/073 主分类号 G01R31/26
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