发明名称 SUBSTRATE-PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate-processing apparatus, capable of suppressing increase in a profile dimension of the apparatus per reaction furnace, while increasing the number of cassettes capable being contained in the apparatus to a maximum limit. SOLUTION: In the substrate-processing apparatus comprising a cassette stage 30 provided on the front surface of a housing 21, a reaction furnace 22 provided in the upper rear part in the housing 21, a rotary cassette shelf 28, a cassette transfer mechanism 29 and a wafer transfer mechanism 27 provided between the stage 30 and the furnace 22, and a boat elevator 24 provided at the lower side of the furnace 22, at least the two furnaces 22 are provided in the upper rear part of the housing 21, the one stage 30 is provided commonly at least with respect to the two furnaces 22, and an auxiliary cassette shelf 31 is provided in the lateral space of the stage 30 generated by commonly providing the stage 30.
申请公布号 JP2001351963(A) 申请公布日期 2001.12.21
申请号 JP20000174065 申请日期 2000.06.09
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 KOTAKE SHIGERU;YANAGAWA HIDEHIRO;NIIMURA NORIHIRO
分类号 C23C16/44;H01L21/205;H01L21/22;H01L21/31;H01L21/324;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 C23C16/44
代理机构 代理人
主权项
地址