发明名称 ADHESIVE SHEET AND CIRCUIT BOARD USING THE SAME AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an adhesive sheet to be used for a circuit board for realizing excellent reliability by improving the adhesive strength of an insulator layer and this circuit board, and a method for manufacturing this circuit board. SOLUTION: An adhesive sheet 404 is provided with a core sheet, adhesive layers 403 formed on the both faces of the core sheet, and a hollow through-hole 402 put through only the part of the core sheet so that the adhesive of the adhesive layer 403 can be allowed to inflow. A metallic foil 405 or the like is overlapped, heated and pressurized so as to be laminated on this adhesive sheet 404. Simultaneously, the adhesive of the adhesive layer 403 is allowed to inflow to the hollow through-hole 402 of the adhesive sheet 404 so that a continuous body ban be formed of the adhesive layer 403 and the adhesive in the through-hole 402 with excellent adhesive property.
申请公布号 JP2001352171(A) 申请公布日期 2001.12.21
申请号 JP20000173201 申请日期 2000.06.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SUZUKI TAKESHI;TOMEKAWA SATORU;OGAWA TATSUO;ECHIGO FUMIO
分类号 C09J7/02;H01L23/12;H01L23/14;H05K1/03;H05K3/00;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 主分类号 C09J7/02
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