发明名称 |
Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards |
摘要 |
Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.
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申请公布号 |
US2001053447(A1) |
申请公布日期 |
2001.12.20 |
申请号 |
US20010849219 |
申请日期 |
2001.05.07 |
申请人 |
TAKANO NOZOMU;SASE SHIGEO;FUKUDA TOMIO;ARATA MICHITOSHI |
发明人 |
TAKANO NOZOMU;SASE SHIGEO;FUKUDA TOMIO;ARATA MICHITOSHI |
分类号 |
B32B27/04;C03C25/40;C08J5/06;C08J5/08;C08J5/24;H05K1/03;(IPC1-7):B32B15/08;B32B17/06;B05D5/12 |
主分类号 |
B32B27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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