发明名称 |
DIAMOND FILM DEPOSITING APPARATUS AND METHOD THEREOF |
摘要 |
A diamond film depositing apparatus and method are disclosed in which a uniform and large plasma is formed on a substrate having a diameter of larger than 100 mm without using a heated filament cathode, without applying a magnetic field thereto, and without using a ballast resistance. The thusly formed plasma is maintained stably for a long time, so that a diamond thick film having a diameter of larger than 4 inches and a thickness of over hundreds of mum can be deposited on a flat or curved substrate and also on a Si wafer.
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申请公布号 |
US2001053422(A1) |
申请公布日期 |
2001.12.20 |
申请号 |
US19990427897 |
申请日期 |
1999.10.27 |
申请人 |
LEE WOOK-SEONG;BAIK YOUNG JOON;EUN KWANG YONG |
发明人 |
LEE WOOK-SEONG;BAIK YOUNG JOON;EUN KWANG YONG |
分类号 |
H01L21/208;C23C16/00;C23C16/26;C23C16/27;C23C16/32;C23C16/50;H01J37/32;H01L21/31;H01L21/469;H05H1/24;(IPC1-7):C23C16/26 |
主分类号 |
H01L21/208 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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