发明名称 |
Semiconductor pressure sensor for e.g., as intake pressure sensor in vehicle engine intake, has semiconductor substrate, diaphragm portion, strain gauge, circuit portion, and local oxidation of silicon film |
摘要 |
A semiconductor pressure sensor comprises a semiconductor substrate; a diaphragm portion formed as a bottom of a recess portion; a strain gauge for generating an electric signal; a circuit portion for detecting the electric signal from the strain gauge; and a local oxidation of silicon film formed on a main surface of a first silicon substrate opposite to a second silicon substrate. A semiconductor pressure sensor comprises a semiconductor substrate (10) including a first silicon substrate (11), a second silicon substrate (12) having a recess portion (2), and an insulation film (13) between the first and second substrates; a diaphragm portion (1) formed by the first silicon substrate as a bottom of the recess portion to be deformed by a pressure; a strain gauge (3) formed on the diaphragm portion for generating an electric signal in accordance with deformation of the diaphragm portion; a circuit portion for detecting the electric signal from the strain gauge, formed on the first silicon substrate at a portion other than the diaphragm portion; and a local oxidation of silicon (LOCOS) film formed on a main surface of the first silicon substrate opposite to the second silicon substrate. The LOCOS film (15) is located outside an outermost peripheral portion (G) of a thin-wall portion of the diaphragm portion and electrically isolating the strain gauge from the circuit portion.
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申请公布号 |
DE10128577(A1) |
申请公布日期 |
2001.12.20 |
申请号 |
DE20011028577 |
申请日期 |
2001.06.13 |
申请人 |
DENSO CORP., KARIYA |
发明人 |
ISHIO, SEIICHIRO;TOYODA, INAO;HAMAMOTO, KAZUAKI;SUZUKI, YASUTOSHI |
分类号 |
G01L9/04;B81B3/00;B81B7/02;B81C1/00;G01L9/00;G01L9/06;H01L21/84;H01L27/12;H01L29/84;(IPC1-7):B81B3/00;B81B7/00;H01L27/04 |
主分类号 |
G01L9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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