发明名称 Semiconductor pressure sensor for e.g., as intake pressure sensor in vehicle engine intake, has semiconductor substrate, diaphragm portion, strain gauge, circuit portion, and local oxidation of silicon film
摘要 A semiconductor pressure sensor comprises a semiconductor substrate; a diaphragm portion formed as a bottom of a recess portion; a strain gauge for generating an electric signal; a circuit portion for detecting the electric signal from the strain gauge; and a local oxidation of silicon film formed on a main surface of a first silicon substrate opposite to a second silicon substrate. A semiconductor pressure sensor comprises a semiconductor substrate (10) including a first silicon substrate (11), a second silicon substrate (12) having a recess portion (2), and an insulation film (13) between the first and second substrates; a diaphragm portion (1) formed by the first silicon substrate as a bottom of the recess portion to be deformed by a pressure; a strain gauge (3) formed on the diaphragm portion for generating an electric signal in accordance with deformation of the diaphragm portion; a circuit portion for detecting the electric signal from the strain gauge, formed on the first silicon substrate at a portion other than the diaphragm portion; and a local oxidation of silicon (LOCOS) film formed on a main surface of the first silicon substrate opposite to the second silicon substrate. The LOCOS film (15) is located outside an outermost peripheral portion (G) of a thin-wall portion of the diaphragm portion and electrically isolating the strain gauge from the circuit portion.
申请公布号 DE10128577(A1) 申请公布日期 2001.12.20
申请号 DE20011028577 申请日期 2001.06.13
申请人 DENSO CORP., KARIYA 发明人 ISHIO, SEIICHIRO;TOYODA, INAO;HAMAMOTO, KAZUAKI;SUZUKI, YASUTOSHI
分类号 G01L9/04;B81B3/00;B81B7/02;B81C1/00;G01L9/00;G01L9/06;H01L21/84;H01L27/12;H01L29/84;(IPC1-7):B81B3/00;B81B7/00;H01L27/04 主分类号 G01L9/04
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