WIRE BONDING STRUCTURE BETWEEN SEMICONDUCTOR CHIP AND SUBSTRATE, SEMICONDUCTOR PACKAGE USING THE SAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
摘要
申请公布号
KR20010111602(A)
申请公布日期
2001.12.19
申请号
KR20000032213
申请日期
2000.06.12
申请人
AMKOR TECHNOLOGY KOREA, INC.
发明人
HA, SEON HO;KO, SEOK GU;PARK, YEONG GUK;SIM, IL GWON
