A mold clamping apparatus comprises a frame including a holding portion for holding the mold resisting the generated mold opening force and an open portion allowing the mold to be inserted into/taken out from the holding portion in the direction of the longer side of the mold, mold moving device for moving the mold to insert/take out the mold into/from the holding portion through the open portion in the frame; and mold opening/closing device for opening/closing the mold located outside the frame. This mold clamping apparatus is capable of holding the mold securely in a closed state resisting a pressure intending to open the mold and allows reduction of energy consumption, equipment maintenance cost, production cost, and the size thereof to be achieved.
