发明名称 LEAD ELECTRODE STRUCTURE HAVING MESH SURFACE
摘要 A compound electrode (1) incorporating a lead substrate utilizes the lead as a support structure (5). This support structure (5) provides a surface that engages a mesh member (2), e.g., a valve metal expanded metal mesh. The mesh member (2) has a fron t (6) and back surface with the back surface facing the lead support structure (5). At least the front surface (10) of the mesh member (2) is an active surface. Securing of the me sh member (2) to the lead support structure (5) in electrical connection permits the lead support structure (5) to serve as a current distributor for the mesh member (2). The mesh member (2) may engage the surface (6) of the lead support structure (5) as by pressing or rolling the mesh on to the lead. Other engagement means can include the use of fasteners, or welding and the like. The resulting structure can be particularly useful as an electrode (3) assembly for use in an electrolytic cell that serves for the electrowinning of a metal.
申请公布号 CA2311724(A1) 申请公布日期 2001.12.15
申请号 CA20002311724 申请日期 2000.06.15
申请人 ELTECH SYSTEMS CORPORATION 发明人 MARTIN, BARRY L.;SCHUE, THOMAS J.;BISHARA, JERIES I.;HARDEE, KENNETH L.;POHTO, GERALD R.;GETSY, ANDY W.;ERNES, LYNNE M.;TURK, THOMAS R.;BROWN, CARL W., JR.
分类号 C25B11/03;C25B11/04;C25B11/08;C25C7/02;(IPC1-7):C25C7/02 主分类号 C25B11/03
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