| 摘要 |
PROBLEM TO BE SOLVED: To reduce the area and size of a module for optical communication. SOLUTION: Circuit parts such as optical fiber 22, a dicing slit total reflection mirror 23, a photodetector 24, and an optical-circuit-side electrode pad 25, and an integrated circuit chip 32 are overlapped above and below, thus reducing the area and size of an integrating optical module 1. |
