| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an epoxy resin composition for an photosemiconductor sealing excellent in transparency and solder resistance. SOLUTION: In a method of manufacturing an epoxy resin composition for an photosemiconductor sealing which contains as essential components, an epoxy resin, a curing agent, a cure promoter, and an inorganic filler, the inorganic filler and at least a part of the resin composition are melt mixed, or the inorganic filler and at least a part of the melt of the resin composition are mixed, and the mixture is treated with a wet bead mill, then pulverized, and the pulverized material and the rest of the components are preliminarily mixed, and then it is heated and kneaded. |
