| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing an elastic wave device, which reduces damage to IDT electrodes on an elastic surface wave element when this element is cut and divided with laser beam radiation on a piezoelectric wafer. SOLUTION: The method of manufacturing an elastic wave device comprises a step of forming a piezoelectric wafer, an elastic surface wave element comprising at least one IDT for transmitting or receiving an elastic surface wave and at least one reflector on the piezoelectric wafer, and a dummy electrode along a scribe line between the elastic surface wave element and adjacent elastic surface wave element; a step of inspecting the elastic surface wave element on the piezoelectric wafer, using a wafer probe; and a step of radiating a laser beam from above the dummy electrode between the elastic surface wave elements.</p> |
