| 摘要 |
A magnetic head comprises a bump electrically connected to a head element on a side wall of a slider, and a pad covering a protective layer and a contact area of the bump exposed from an flat surface of the protective layer. In the magnetic head, since a bonding member for bonding a conductive pattern to the pad is bonded in a bonding area of the pad formed on the protective layer, secure bonding can be obtained regardless of the form of the contact area of the bump, and a highly reliable magnetic head, without bonding defects, can therefore be provided.
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