发明名称 COMPONENT SUCTION NOZZLE AND DIE BONDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a component suction nozzle which can suck even a small component easily, and to provide a die bonding apparatus. SOLUTION: The component suction nozzle 6 has a nozzle body 61 where a through hole 62 is formed. The through hole 62 functions as a suction hole for sucking a stem 2 and as a passage for flowing a coolant gas to cool the stem 2 or the like heated by means of a heater part 9. On a top surface of a support base 70 provided at a tip of the nozzle body 61, ventilating recesses 72a, 72b extending in a radius direction of the nozzle body 61 are formed so as to be sandwiched in protruding portions 71a, 71b for receiving the stem base. The ventilating recesses 72a, 72b, in sucking the stem 2, become an inlet opening for introducing air into the through-hole 62 and, in cooling the stem 2 or the like, become an exhaust opening of the coolant gas introduced into the through-hole 62.
申请公布号 JP2001338937(A) 申请公布日期 2001.12.07
申请号 JP20000157017 申请日期 2000.05.26
申请人 NIDEC COPAL CORP;NIDEC TOSOK CORP 发明人 ICHIHARA MASAKATSU;IZUMI MASANORI
分类号 B25J15/06;H01L21/52;(IPC1-7):H01L21/52 主分类号 B25J15/06
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