APPARATUS AND METHOD FOR CUTTING SPHERE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME AND METHOD FOR MANUFACTURING SOLAR CELL

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having an easy manufacture and high reliability by improving its yield and to provide a semiconductor device having high reliability without needing a special manufacturing apparatus. SOLUTION: A method for cutting sphere comprises the steps of inserting the sphere such as a solar cell or the like into a groove of a V-shaped section formed to insert the sphere to be cut, accurately fixing the sphere together with a resin in the groove, and splitting the sphere into hemispheres by a cutting blade in a fixed state.