发明名称 Buried layer and method
摘要 A high resistivity silicon for RF passive operation including CMOS structures with implanted CMOS wells and a buried layer under the wells formed by deep implants during well implantations.
申请公布号 US2001048135(A1) 申请公布日期 2001.12.06
申请号 US20010798106 申请日期 2001.03.02
申请人 LEIPOLD DIRK 发明人 LEIPOLD DIRK
分类号 H01L21/02;H01L27/06;(IPC1-7):H01L31/119;H01L31/113;H01L29/76 主分类号 H01L21/02
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