发明名称 ABRASIVE COMPOSITION AND POLISHING METHOD USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide an abrasive composition which makes colloidal silica highly stable in polishing the surfaces, particularly, metallic surfaces of various kinds of semiconductor devices, magnetic disks, etc., and can maintain a stable polishing characteristic for a long time and with which a high-accuracy high- quality specular surface can be obtained. SOLUTION: This abrasive composition contains water, cationic colloidal silica, and a metal nitrate.</p>
申请公布号 JP2001332518(A) 申请公布日期 2001.11.30
申请号 JP20000150329 申请日期 2000.05.22
申请人 TOKUNAGA TAKAAKI 发明人 TOKUNAGA TAKAAKI
分类号 B24B57/02;B24B37/00;C09K3/14;H01L21/304;(IPC1-7):H01L21/304 主分类号 B24B57/02
代理机构 代理人
主权项
地址