HEAT-RESISTANT RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To improve the heat-resistance of an epoxy resin structure of an epoxy resin reinforced with a glass fiber cloth for increasing the mounting density of a printed circuit board and to obtain an inexpensive material for the above method. SOLUTION: The objective resin composition contains a polysiloxane structure having an aryl group in combination with an epoxy resin structure having an aryl group in itself. The polysiloxane structure is preferably a phenylalkoxysilane polymer.