发明名称 Partially covered motherboard with EMI partition gateway
摘要 An improved assembly for a computer that includes a motherboard having a first side and a second side. The first side has a first portion and a second portion. The first portion contains components capable of generating substantial heat and a strong electric field. The assembly further includes an EMI attenuating cover that encloses the first portion of the first side of the motherboard, but does not enclose the second portion of the first side of the motherboard.
申请公布号 US6324075(B1) 申请公布日期 2001.11.27
申请号 US19990459442 申请日期 1999.12.20
申请人 INTEL CORPORATION 发明人 UNREIN EDGAR J.;LE MINH T.;HANES CHRIS H.;EGGER RON D.
分类号 G06F1/18;G06F1/20;H05K9/00;(IPC1-7):H05K9/00 主分类号 G06F1/18
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