| 发明名称 |
Method of wire bonding for small clearance |
| 摘要 |
A method of wire bonding for small clearance employs a conductive bump over the pad of a chip to prevent a capillary from colliding with the chip during three-dimensional package wiring process. The conventional constraint which limits the clearance to greater than 0.2 mm so as to find an appropriate capillary is overcome in this method.
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| 申请公布号 |
US6321976(B1) |
申请公布日期 |
2001.11.27 |
| 申请号 |
US20000577686 |
申请日期 |
2000.05.22 |
| 申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
LO RANDY H. Y.;PU HAN-PING;YUAN TONY |
| 分类号 |
B23K20/00;H01L21/607;(IPC1-7):B23K37/00;B23K31/00;H01L23/495 |
主分类号 |
B23K20/00 |
| 代理机构 |
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| 主权项 |
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