PLATING DEVICE AND PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a plating device and plating method which exhibit the performance, such as a plating film thickness distribution, equal to or higher than that of the conventional system by providing a plating tank which is simple the structure of the plating tank by taking advantage of a single sheet shielding plate system, is short and compact in length and is simple in the work for controlling and regulating the film thickness distribution. SOLUTION: This plating device has the plating tank and is pendently provided with an anode plate 7 in the plating tank 1. An object to be plated 8 is pendently disposed to face the anode plate and a sheet of the shielding plate 11 having an aperture 30 is disposed between the anode plate 7 and cathode holder 9 in the plating liquid in the plating tank. The opening area of this aperture is made adjustable.