| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si series copper allay for electronic apparatus highly maintaining mechanical and physical properties, excellent in surface properties and further producible at a low cost. SOLUTION: This copper alloy for electronic apparatus excellent in surface properties has a composition essentially consisting of, by weight, 0.4 to 4.0% Ni and 0.1 to 1.0% Si and containing, as assistant components, one or more kinds selected from 0.001 to 0.1% P, 0.05 to 1.0% Zn, 0.01 to 0.5% Mn and 0.005 to 0.1% Ag by 0.005 to 2.0% in total, and the balance Cu with inevitable impurities, and in which the size of Si oxide present in the surface layer from the surface to a depth of 1μm is <=0.1μm Since Si oxide with a size exceeding 0.1μm damaging surface properties such as solder wettability is not present in the surface layer, its surface properties are improved. Since heat treatment in a nonoxidizing atmosphere or the like is not required, the alloy can be produced at a low cost.
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